Czasopismo | INŻYNIERIA MATERIAŁOWA | Rocznik 2013 - zeszyt 3

Morphology and chemistry characterization of intermetallic phases in (Cu + 5 at. % Ni)/Sn-Ag-Sn/(Cu + 5 at. % Ni) interconnections

Anna Wierzbicka -Miernik

nr katalogowy: 78037

Nowadays, finding the lead free substitutes for the Pb-high content solder materials for the use at the higher (250÷350°C) temperature [1÷6] as well as development of the new soldering techniques in the electronic industry are of prime importance in the environment friendly technologies. The diffusion soldering is the alternative joining technique which results in the interconnections characterized by the high thermal stability combined with relatively low-temperature of soldering [7÷10]. However, in order to apply this technique in the production line it is necessary to shorten the time to several seconds of soldering process. Recently, number of experiments have been performed in order to find suitable additions which could accelerate the diffusion during the soldering process [11, 12]. The presence of the Ni addition, even in very small amount (~5 at. %), in the Cu pads caused the suppression of the Cu3Sn phase formation in the reaction zone at substrate/solder interface. Additionally, the nickel significantly changed the morphology of the Cu6Sn5 intermetallic compound growing in the joints and which was even more important increased the rate of its formation. However, some discontinuities were present in the centre of the interconnections (for example Fig. 1d in Ref. [13]). The same problem was reported by Chung et al. [14] in the case of Cu/Sn/Cu/Sn/Ni diffusion couples aged at 200°C for different times. The discontinuities are described as the ‘‘Kirkendall voiding’’. Their occurrence is caused by the agglomeration of excess vacancies as the result of the different intrinsic diffusivities of Cu and Sn in the forming intermetallic phase [15]. The amount of Sn diffusing across the (Cu, Ni)6Sn5 phase is more than Cu [16]. It is also known that the voids are mostly generated within Cu3Sn layer, but rarely within the Cu6Sn5 layer [17÷23]. However the lack of Cu3Sn phase in our previous studies [13] was [...]

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