Czasopismo | ELEKTRONIKA - KONSTRUKCJE, TECHNOLOGIE, ZASTOSOWANIA | Rocznik 2011 - zeszyt 3

Model of high rate reactive pulsed magnetron sputtering

nr katalogowy: 58392

Several models have been developed to describe reactive magnetron sputtering process. Most of them were based on the classical model derived by Berg et al. [1], which is mainly focused on the target surface condition influence. However, the deposition mechanism is complicated and could not be precisely described with simple analysis of sputtered surface. It requires also studies of collecting area state, plasma properties, particle transport, etc. The deposition of aluminium oxide can be successfully used to illustrate the sputtering process. Aluminium and aluminium oxide differs strongly in regard to emission and sputtering properties. The sputtering yield of Al2O3 is lower than Al, thus with progressing oxidation of the target deposition rate is decreasing. On the other hand, aluminium oxide has two times higher ion induced secondary electron emission coefficient, what indicates increase of emission and changes of plasma impedance. Those properties make aluminium an ideal material for illustrating mechanisms which influence on reactive sputtering process. Experimental details With reference to the Berg’s model, high rate reactive pulsed magnetron sputtering of the aluminium target in argon and oxygen gas mixtures has been studied. High quality dielectric layers were deposited with use of the DPS pulsed power supply and the special construction of magnetron source [2, 3]. The magnetron source WMK-50 equipped with a 50 mm diameter and 7 mm thick aluminium target was used during the experiments. Substrate to target distance was dS-T= 75 mm. The available maximum target power density was about 1000 W/cm2 (however not used in this experiment). The process has been performed in a vacuum system equipped with a rotary and diffusion pump with a pumping speed of 2000 l/s. The final pressure of the deposition chamber was about 2 mPa. All experiments were performed in atmosphere of argon and oxygen gas mixture with total press[...]

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2011-3

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