Czasopismo | INŻYNIERIA MATERIAŁOWA | Rocznik 2010 - zeszyt 3

Microstructure and mechanical properties of the Cu/SnAuCu/Cu joints

nr katalogowy: 52765

The European Union regulations forced the manufactures to limit the use of certain hazardous substances such as cadmium and lead in the electrical and electronic equipment and also make them responsible for its storage and recycling [1, 2]. In a consequence the lead-free interconnection technology is one of the most active branches of the nowadays materials science. PbSn replecements are mainly the tin alloys, among which a special class are those consisted of tin and noble metals such as copper, silver and gold. They are possesing two characteristic features - the high melting point and high concenteration of Sn compared to that of eutectic PbSn. Moreover, the composition of the lead-free solders can be described as eutectic or near-eutectic, which ensures the best manufacturability. The microstructure of these solders is a mixture of tin and the intermetallic phase (IP). Since both mechanical and electrical properties of the tin are anisothropic they are also anisothropic in the case of eutectic solders. Therefore, the intermetallics may take a form of the inhomogenous structures (for example Ag3Sn in the shape large plate-like crystals). To avoid of such IP creation the concentartion of silver in SnAg solder should be less than 3% wt. and copper should not go over than 0.7% wt. in SnCu solders. In the case of SnAu solders gold must not exceed the value of 5% wt. otherwise it leads to the formation of AuSn4 phase which causes britlle “cold" joint. Ternary solders are mainly SnAgCu solders (SAC) where the amounts of silver and copper (corresponding to the eutectic composition) are 3.5±0.3 and 0.9±0.2 (wt. %), respectively [3÷5]. Other ternary solder is SnAuCu alloy which may be used as a joining material for the joints in so-called noble electronics. They are applied in devices with the highest degree of reliability, such as biomedical devices. It should be noted that such products after their exploitation und[...]

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