Czasopismo | INŻYNIERIA MATERIAŁOWA | Rocznik 2010 - zeszyt 3

Microstructure of Cu-Ag-P alloy layers plasma sprayed on AgSnO2 composite material

nr katalogowy: 52699

Plasma spraying is a method currently widely used mainly in the aircraft, automotive, armaments industry for spreading metallic and ceramic layers on construction components working in the extreme mechanical and thermal conditions. During the plasma spraying the material in a form of powder or wire melted in plasma arc falls on the sprayed surface in a form of melted particles [1, 2]. Very high temperature of plasma stream, at the level of several thousand Celsius degrees, and the possibility to control power of the plasma torch in a wide range bring possibility for spraying virtually every kind of material, provided that it will not undergo process of evaporation or decomposition. Most often the technique is used to produce coatings of high-melting metals, oxide materials, nitrides, carbides and cermets. The basic advantage of sprayed coatings is their high resistance to abrasion, corrosion, thermal shocks and high-temperature creep resistance. The additional benefit is high rapidity and repeatability of the process as well as possibility to join materials of different melting points and high coherence of the binding layer-basic material. Current intensity and plasma arc voltage are the basic energy parameters of the spraying process, reflected by power of the plasma torch as well as by the type of plasma forming gazes and intensity of their flow which influence, among others, arc temperature. The properties of the layers produced in the process are also influenced by such geometric parameters as the distance between plasma torch nozzle and surface. When spraying with powder material also powder shape and morphology becomes important. Spherical powders are considered optimal for that application, as they have lower porosity, higher density and better flow rate than the powders of more developed surface (rough). In the study the plasma spraying technique was used for spreading a layer of a binder of Cu-Ag-P type on a composite [...]

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2010-3

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