Czasopismo | ELEKTRONIKA - KONSTRUKCJE, TECHNOLOGIE, ZASTOSOWANIA | Rocznik 2010 - zeszyt 4

Corrosion reliability of microelectronic devices. Part 2. Models and experimental results

ZDZISŁAW TRZASKA

nr katalogowy: 51388

This is a two-part series that introduces the corrosion reliability of microelectronic devices. Corrosion is one of the most critical degrading mechanisms that pose direct threat to the structural integrity of microelectronic products and integrated devices. Their life time is influenced mainly by a decrease of dimensional accuracy being a major contributing factor. This is because interconnections between various elements and components must be precisely designed to environment of the use of microelectronic devices. Moreover, the availability of low-loss, low-cost, and easily-fabricated components that can withstand the high temperature incurred during lamination and reflow process that do not degrade over time is as most important. Thus thermal stability and impact of chemical composition on the environment aggressiveness are crucial to corrosion reliability. Part I appeared in the March 2010 issue and covered a survey of fundamentals concerning susceptibility of current copper-based printed and integrated circuit boards and their limitations. It also introduced the failure rate of microelectronic systems caused by corrosion of their elements. Part II will feature the modeling procedures of electrochemical corrosion of microelectronic materials and reliability diagnostic of manufactured products. Therefore, the possibility of applying the electrochemical impedance spectroscopy is presented. Results of performed experiments are also demonstrated. Equivalent circuit models for common electrochemical corrosion processes One of the major trends of the present century is the growing need for fast and high capacity communication systems. For this reason microelectronic devices must become more efficient and, as a consequence, smaller in size. The environment containing aggressive chemical species such as chloride, fluorine or fluorine mixtures, HF acid, sulfuric acid, soluble salts, and a different aeration of device cells can [...]

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2010-4

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