Czasopismo | INŻYNIERIA MATERIAŁOWA | Rocznik 2016 - zeszyt 6

Copper/nanodiamond composite coatings obtained by electrochemical deposition

10.15199/28.2016.6.5

nr katalogowy: 103155
10.15199/28.2016.6.5

Copper composite coatings with nanodiamond particles were electrochemically deposited. Depositions were made on copper sheet basis in acid sulphate solutions with and without organic additives. The studies indicate the possibility of electrochemical deposition of composite Cu/diamond coatings and the coating properties depend on solutions composition. The concentration of the diamond preparation in process electrolyte solutions was about 0.5 g/dm3. The composites surface morphology was investigated by SEM microscopy and chemical composition with EDS microanalysis. Concentrations of diamond particles in samples surfaces were evaluated by ImageJ computer analysis. Hardness of coatings were measured by Vicker’s method. Key words: composite coatings, copper/nanodiamond composites, electron microscopy, EDS analysis, hardness measurements.1. INTRODUCTION Metal matrix composites with incorporated disperse phases are intensively investigated. The research is aimed at the production of materials having improved mechanical, tribological, electrical, thermal, and other properties. An important area of application are power electronics devices. The evolution of devices in a miniaturization direction causes problem of heat dissipation of integrated circuits based on semiconductors commonly used, such as Si, SiC and GaAs, and new one like GaN [1]. New electronic devices would be implemented in telecommunications, aerospace, military equipment and other industries [2÷7]. Copper is attractive as a matrix material because of good electrical conductivity, but also very good mechanical properties, like plasticity. There are attempts to incorporate into Cu matrix additional phase of carbon particles, also like micro- and nanodimensional diamonds [8]. Advantageous properties for this kind of material is its large thermal conductivity and low thermal expansion coefficient. Diamond is also hardest known material. Obtaining a composite material with di[...]

Bibliografia

[1] Barcena J., Maudes J., Coleto J., Obieta I.: Novel copper/carbon nanofibers composites for high thermal conductivity electronic packaging. Diamond 50 (2006) 5.5.
[2] Chu K., Jia C., Tian W., Liang X., Chen H., Guo H.: Thermal conductivity of spark plasmasintering consolidated SiCp/Al composites containing pores (Numerical study and experimental validation). Compos. Part AAppl. S. 41 (2010) 161÷167.
[3] Molina J. M., Prieto R., Narciso J., Louis E.: The effect of porosity on the thermal conductivity of Al-12 wt % Si/SiC composites. Scripta Mater. 60 (2009) 582÷585.
[4] Schubert Th., Brendel A., Schmid K., Koeck Th., Ciupiński Ł., Zieliński W., Weißgarber T., Kieback B.: Interfacial design of Cu/SiC composites prepared by powder metallurgy for heat sink applications. Compos. Part A-Appl. S. 38 (2007) 2398÷2403.
[5] Yoshida K., Morigami H.: Thermal properties of diamond/copper composite material. Microelectron. Reliab. 44 (2004) 303÷308.
[6] Ren S., Shen X., Guo C., Liu N., Zang J., He X., Qu X.: Effect of coating on the microstructure and thermal conductivities of diamond-Cu composites prepared by powder metallurgy. Compos. Sci. Technol. 71 (2011) 1550÷1555.
[7] Weber L., Tavangar R.: On the influence of active element content on the thermal conductivity and thermal expansion of Cu-X (X = Cr, B) diamond composites. Scripta Mater. 57 (2007) 988÷991.
[8] Kruszewski M., Rosiński M., Grzonka J., Ciupiński Ł., Michalski A., Kurzydłowski K. J.: Kompozyty Cu-diament o dużym przewodnictwie cieplnym wytwarzane metodą PPS. Mat. Ceram. 64 (2012) 333÷337.
[9] Medeliene V., Stankevic V., Bikulcius G.: The influence of artificial diamond additions on the formation and properties of an electroplated copper metal matrix coating. Surf. Coat. Technol. 168 (2003) 161÷168.

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