Wyniki 1-1 spośród 1 dla zapytania: authorDesc:"Jarosław Cimek"

Hot embossing method for development of soft glass microoptic components with broadband infrared transmission DOI:10.15199/ELE-2014-205

  Recently we have witnessed a dynamic progress in research and applications of optoelectronics within the infrared (IR) spectrum. In this wavelength range most of the commonly used optical materials such as fused silica glass cannot be used due to high attenuation beyond 2 [mikro]m. There are other materials, suitable for this range, like single crystalline germanium, zinc selenide, chalcogenide glass or GASIR glass [1]. The main problems with the abovementioned materials concern their fabrication, toxicity, relatively high cost and lack of transparency within the visible light range. Therefore it is necessary to study new materials that could be used for the low-cost production of optical components for mid-IR. One of the solutions are the polymer materials. They are low-cost and easy to process, but also show low thermal durability and variation of their optical parameters over time. A possible alternative solution to these problems is to use heavy metal oxide soft glasses. One of the low-cost methods used in the fabrication of optical elements is hot embossing [2], especially appropriate for fabricating polymer elements. The HE method can also be used with glass, but this involves several problems of technical kind. First, the process requires higher temperatures 400-900°C, depending on the composition of the glass used. Secondly, the process requires better temperature stabilization to make the hot glass malleable but not molten and to avoid crystallization. Thus, using soft glasses to fabricate elements with the HE method requires a series of tests to optimize the choice of material and the process. Selection of glasses and materials for mold One of the most important stages of work with a hot embossing system is the choice of the material for the mold, as its thermal expansion coefficient must be close to that of the molded material. Moreover the molded [...]

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