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Dynamical processes simulation of vibrational mounting devices and synthesis of their parameters DOI:10.15199/48.2019.04.15

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The problem of assembly automating by using of robots (manipulators) for increasing labor productivity, releasing hands, improving the work quality, as well as performing hazardous for health, physically heavy and monotonous work is actual for different industries. One of the promising directions in this problem solving is the use of uncontrolled, in particular, vibrational assembled devices. It’s using allow to abandon expensive sensors and servo drives at the assembly process even for non-axisymmetric parts without chamfers, does not impose high demands on the rigidity of the entire robot design. The assembly is as follows. The robot gripper "roughly" brings the assembling part, which is installed in the grab of the vibrational assembling device, to the connection point with another part (for example, a plunger to the plunger barrel). The assembling device is turn on, the part with the grab starts to do some spatial oscillations, and the parts are mated, even though the position of the assembling part was initially inaccurate. Spatial oscillations of the grab and parts are given by an unbalanced motor, which mounted on the assembling device. In Fig. 1 shows the assembly device with a vibrational mounting mechanism. In paper [1] mathematical models of devices for robots with low-frequency vibrations were created. Paper [2] is proposed the algorithms developments for the functioning of assembly mechanisms in shipbuilding. Paper [3] is devoted to dynamic processes simulation at starting process of vibrational mechanisms. Features of sensors and servo drive using are analyzed in paper [4], adaptive automatic grabs are considered in [5, 6]. An analysis of the design features of vibrational mounting devices is given in paper [7]. The simplest methods of parameters choosing for mechanisms are also presented there. Dynamic processes simulation in some devices with unbalanced vibro drives is devoted papers [8, 9], electroma[...]

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