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Hardness and texture of Cu/Ni multilayers differing in Ni sublayer thickness

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Multilayers of nanometric period thicknesses are characterized by unique properties (magnetic, optical, mechanical etc.) resulting from the presence of a large number of interfaces in such materials. The properties of such multilayers can be completely different from those of the multilayers in which the period thickness is in the order of a micrometer, even if they are built of the identical components [1, 2]. A great development of nanomaterial examination techniques has taken place in recent years. X-ray techniques, transmission and atomic force microscopy are most commonly used for examination. A measurement method which is most often used for determining the mechanical properties of nanomaterials is the microhardness test. Recent studies have shown that multilayers attain the maximum hardness when the thickness of their period is within the range from several to some dozens nanometers. This extraordinary property enables a number of potential application uses of multilayers in the “engineering of future" [3÷6]. Notwithstanding the fact that hardness represents an important material characteristic, an increasingly greater weight is being attached to the most subtle feature of the structure, that is the texture [7÷10]. The purpose of the study is to determine the effect of the Cu/Ni multilayer texturing degree on mechanical properties, such as nanohardness and Young’s modulus. methodology and the material The material used for tests were Cu/Ni multilayers fabricated on a monocrystalline Si(100) silicon substrate by the magnetron deposition method. The multilayers were differentiated by Ni sublayer thickness Ni (1.2; 1.4; 1.5; 1.6; 2.5; 3.0 nm), while maintaining a fixed Cu sublayer thickness of 2 nm. Each multilayer was built of 100 periods (Fig. 1). A period is the sum of the thicknesses of two sublayers. The thickness of each in[...]

Zastosowanie niskokątowej analizy promieniowania X (GIXA) do badań układów cienkowarstwowych

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Ze względu na postępujący stopień miniaturyzacji układów elektronicznych, struktury wielowarstwowe stają się coraz cieńsze, a grubości niektórych warstw wynoszą kilka warstw monoatomowych. W związku z tym bardzo dokładny pomiar grubości, w celu wycechowania aparatury, za pomocą której warstwy są nanoszone jest bardzo ważny. Zastosowanie promieniowania rentgenowskiego umożliwia pomiar grubośc[...]

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